Counterfeit Avoidance and Component Reliability Testing

This service provides the best shipping practices for moisture-sensitive equipment by baking units in a low heat oven based on the MSL level set by JEDEC standard 033B. After baking, parts are sealed in ESD safe dry-packing to maintain electronic component integrity against moisture-related corrosion.

This mechanical test process determines the bond quality of wires bonding agents within components. It verifies bond consistency and reliability and evaluates using the wire pull test, in which malleable bond wires are tested by being pulled upward (i.e., perpendicular to the substrate) until wire breaks or the bond fails.

This testing is a process used to detect early failures in components to ensure higher reliability and reduce defect-parts-per-million (DPPM) to near null. Burn-in testing uses both electric and heat stress to diminish component integrity, thereby replicating long-term usage. We can estimate a product’s useful life period and reduce the frequency of exasperating product returns.

By using constant acceleration to simulate the effects of acceleration on electronic devices, this centrifuge test is an efficient indicator of mechanical and structurally weaknesses overlooked by vibration or mechanical shock tests.

This process ensures optimal component functionality with coplanarity testing, which measures the deviations of terminals on surface-mounted devices (SMD), such as semiconductors. It ensures device leads will align and sit correctly.

Counterfeiting from non-traceable OEM components costs companies millions of dollars every year. Our counterfeit detection services, which rely on an amalgamation of quality tests, will help you ensure your components are legitimate and meet industry demands. Common tests included visual inspection for tampering or blacktopping and heated chemical testing.

Using focalized ultrasound pulses, C-SAM images material interfaces to detect elusive, non-destructive physical damages and material irregularities, such as delamination, voids and porosity, cracks, and foreign materials, and identify the root causes of component failure.

This process removes part of a device, either chemically or mechanically, to expose its internal structure, thereby allowing inspection of the die, interconnects, and other elements during failure analysis, constructional analysis, and destructive physical analysis.

Synergy can help program a variety of devices by utilizing its network of industry experts to assist their clients.

We can recreate operating conditions to determine where failure is occurring. In such an analysis, we use a host of testing services, such as C-SAM, x-ray, and decapsulation, to identify the root causes of device failure.

Fluorescent dye penetrant is used in an inspection process used to detect imperfections, such as cracks, in a component’s surface It is most effective on metal components with non-porous surfaces.

Identifying signs of prior markings, sanding, pitting, differing body material, and general tampering are paramount. This process allows us to identify these signs useful for improving counterfeit avoidance.

This testing service is used to determine seal effectiveness in microelectronic component packages. Damaged seals can result in internal corrosion due to moisture contamination that can result in component failure detriment to supply chain processes.

Screening can be performed for diodes of lower or unknown ratings to JAN/JANTX/JANS requirements. Same-type devices can be revised for interchangeability, despite manufacturing date code or conformance inspection completion data.

The Particle Impact Noise Detection (PIND) Test is a non-destructive method used to detect free particles inside electronic components.

Devices and components are coated with a metal filler, and lead finishes can be changed to non-leaded or vice versa. This process also improves and restores the solderability of parts and one of the methods used to reduce tin whiskers that can form when pure tin plating is used.

Solderability testing is the process of evaluating the solderability of terminations and their compliance with industry standards. Solder wetting is the uniform, smooth, and unbroken film on the soldered surface. Our tests ensure that soldered adherence is excellent and covers at least 95% of the terminations.

Resistance to solvent (or marking permanence) is a test designed to determine that component materials and finishes will not have deleterious mechanical or electrical reactions when exposed to solvents. This test also determines if markings on parts will become illegible when exposed to solvents.

We provide reeling services for materials on tape and reel, including re-reeling into original carrier tape or new media.

Temperature Cycle Test (TCT) is designed to evaluate components for fatigue failures by testing their resistance to extremely hot and cold temperatures. In conjunction with electrical/functional and visual testing, TCT can be used to determine component quality and longevity.

A non-destructive and quick investigative tool, an x-ray is an effective way to view a device’s internal structure, such as internal die orientation, bond wire patterns, voids, and abnormalities.

Clients can obtain products with lower functionality ratings (e.g., temperature and rated speed) and have them tested against more demanding applications. Upscreen testing is particularly useful for substituting similar but differently rated devices during availability constraints.

X-ray fluorescence (XRF) spectrometry is an elemental analysis technique that is widely used across numerous scientific and technological industries. It is capable of analyzing a component’s composition, PCB and component assemblies, metal composition. XRF capabilities also allow us to validate components for the restriction of hazardous substances (ROHS), which is essential for determining is parts are compliant with environmental standards.